Copper Plating

Submersion copper plating is an electroplating process used to deposit a layer of copper onto various substrates. It is commonly employed in the manufacturing and finishing of many base metal materials for many industrial applications. Here’s a brief overview of the process:

1. Surface Preparation: Before plating, the substrate is thoroughly cleaned to remove any contaminants, ensuring good adhesion of the copper layer.
2. Electrolyte Solution: subversive copper plating typically uses a copper sulfate-based electrolyte solution.
3. Electroplating Bath: The substrate is immersed in the electrolyte solution. A direct current (DC) is applied to an anode, usually made of copper, and the substrate serves as the cathode.
4. Copper Deposition: As electricity flows through the solution, copper ions from the electrolyte are reduced and deposited onto the substrate. This process results in the gradual buildup of a uniform copper layer.
5. Control of Plating Parameters: Factors like bath temperature, current density, and plating time are carefully controlled to achieve the desired thickness and quality of the copper deposit.
6. Post-Plating Steps: After plating, the substrate is rinsed, dried, and may undergo further processes like polishing, etching, or additional plating layers (e.g., nickel and gold) for improved performance and appearance.

Submersible copper plating offers excellent conductivity, corrosion resistance, anti seize/galling, and solder ability, making it a popular choice for various applications, including the electronics industry and petroleum industry in which it is applied to couplings and threaded products for its anti galling and flexible characteristics.